Product Description
Universal Multi-Purpose Solder Stencil 0.3/0.35/0.375/0.4/0.5 ,5° Hole for Mobile Phone CPU BGA Reballing Stencil tool
Key Features
**Product Name:** Universal Multi-Purpose Solder Stencil for Mobile Phone IC Repair
✔ **Wide Compatibility** – Designed for various common ICs used in mobile phones, supporting multiple chip sizes and layouts.
✔ **Three Hole Patterns** – Parallel, 45-degree, and staggered holes for flexible soldering applications.
✔ **Five Pitches Available** – 0.3mm, 0.35mm, 0.375mm，0.4mm, and 0.5mm to suit different IC requirements.
✔ **Multiple Size Options** – Includes 0.4x35x35, 0.35x35x35, 0.5x38x38, 0.4x28x28, 0.4x48x48, 0.35x48x48,0.3x50x50 and more.
✔ **Premium Material** – Made from high-quality 0.12mm Japanese steel for durability and precise solder paste application.
✔ **Versatile Solution** – Solves the problem of missing stencils during phone repairs, ensuring smooth IC rework.
Ideal For:
- Mobile phone repair technicians
- IC soldering and reballing tasks
- Handling various smartphone chips without needing multiple stencils
Product details
About Prime Living
Prime Living is a Canadian online store offering a carefully selected range of quality products for home, automotive, tools, outdoor living, electronics and more.
We are committed to fast order processing, secure packaging and reliable tracked shipping to provide an excellent shopping experience.
Shipping policy
We are always working hard to ensure your package arrives as soon as possible. Please understand that some factors like weather, high postal traffic, and the performance of shipping companies are outside of our control.
Returns
We offer a 14-Day Return Policy on items in which you are not completely satisfied with. You have the option of a full-refund or an exchange of the item.
Condition
Brand New
Shipping
This item is shipped directly from our supplier in China with tracking.