Product Description
ASUS IoT Tinker Board 3N Single Board Computer Rockchip RK3568 SBC Dual LAN Development board Support Linux Debian,Yocto,Android
ASUS IoT Tinker Board 3N Single Board Computer Rockchip RK3568 SBC Dual LAN Development board Support Linux Debian,Yocto,AndroidFeature:
64-bit, quad-core Arm Cortex-A55 processor, built on the Arm v8 architecture
Dual LAN built in, and PoE PD supported via expansion module
4G, 5G, Wi-Fi and Wi-Fi 6 supported via expansion module
LVDS, eDP, COM and CANbus embedded and industrial interfaces supported
0°C to 60°C operating-temperature range
Linux Debian, Yocto and Android operating systems supported
Achieving interoperability, scalability and reliability, ASUS IoT Tinker Board 3N single-board computers (SBCs) deliver Arm®-based power and versatility for embedded applications in NUC size.
64-bit, quad-core Arm Cortex-A55 processor, built on the Arm v8 architecture
Dual LAN built in, and PoE PD supported via expansion module
4G, 5G, Wi-Fi 5 and Wi-Fi 6 supported via expansion module
LVDS, eDP, COM and CANbus embedded and industrial interfaces supported
Wide -40 to 85°C operating-temperature range
Linux Debian, Yocto and Android operating systems supported
ULTIMATE COMPUTING PERFORMANCE WITH NUC-SIZE DESIGN
With its versatile and modern 64-bit, quad-core ARM-based processor — the Rockchip RK3568 — ASUS IoT Tinker Board 3N offers superior performance in NUC size. Powered by an ARM-based Mali™-G52 GPU, Tinker Board 3N offers smoother graphics processing and better data security, allowing for a wide range of applications in smart manufacturing and smart retail such as IoT gateways, human-machine interfacing (HMI), digital signage, self-service kiosk and more.
One of the key advantages of the Tinker Board 3N is its advanced memory configuration to better fulfill diversified market requirement. Featuring LPDDR4X memory, the board offers better data-transfer rates and operates with just 55% of the energy required by LPDDR4, while also boasting 5X-lower power consumption in standby mode compared to DDR4.
OPTIMIZED THERMAL DESIGN
Tinker Board 3N features an advanced thermal design including a low-profile pushpin heatsink and SoC placement on the back side for added strength and ease of installation, with its diminutive NUC-scale dimensions allowing for SWaP-constrained space deployment and flexible system integration.. With reduced thermal throttling, developers can push the limits of performance without compromising stability. It is also engineered to operate smoothly in harsh industrial environments, with an impressive operating-temperature range of -40 to 85°C — making it ideal for everything from outdoor use to hectic factory environments.
MULTIPLE DISPLAYS SUPPORTED
With LVDS support and dual-channel Full HD output, Tinker Board 3N enables seamless integration into a wide range of display systems and thus saves much project deployment time and effort.
IT MANAGEMENT SOFTWARE
ASUS IoT Cloud Console
AICC is a unified platform for managing and analyzing big data collected by IoT devices running different operating systems.
Quick troubleshooting
Remote restart or updates
Dashboard and analysis
ASUS Industrial Android and Linux FOTA
Tinker Board 3N supports firmware over-the-air (FOTA) roll-out, enabling embedded systems developed using the board to be updated remotely with the latest Android firmware, operating system and drivers.
Worldwide content-delivery network
Easy deployment and maintenance
FOTA progress report
SUPPORT FOR THE LATEST OPERATING SYSTEMS
Tinker Board 3N supports a variety of the latest and mainstream operating system platforms, catering to different development environment needs. You have the flexibility to choose from Linux Debian, Yocto, and Android operating systems, ensuring compatibility with preferred software ecosystems.x
SPECIFICATIONS
SoC | Rockchip RK3568 |
CPU | Quad-core Arm® Cortex®-A55 |
GPU | Arm® Mali™-G52 |
Display | 1 x HDMI™ with CEC hardware ready |
Memory Size | Dual-CH LPDDR4/LPDDR4X 2GB / 4GB / 8GB |
Storage | none / 32GB / 64GB eMMC |
M.2 E key 2230 | 1 x for Wi-Fi 5/6 & BT module (PCIe 2.0 x1, USB 2.0) |
M.2 B | 1 x for 4G/5G or SSD module (PCIe 3.0 x1, USB 3.0, USB 2.0, SIM) |
SIM Slot | x1 |
Audio | 1 x 3.5 Phone Jack (w/ Mic) |
USB | 1 x USB 3.2 Gen1 Type-C® OTG port |
CAN Bus 2.0B FD | x1 Pin Header |
COM 232 (with flow control) | x2 Pin Header |
COM 232/422/485 | x1 Pin Header |
Internal Headers | 1 x 40-pin LVDS + eDP connector |
Power Connector 12~24V | 1 x DC Barrel Power Input Jack (5.5/2.5 mm) |
OS Support | Debian 11 / Android 12 |
Dimension | 4 x 4 inches / 100 x 100 mm |
Operation temperature | -40℃ ~ 85℃ |
Non operation temperature | -40℃ ~ 85℃ |
Non operation humidity | 10% ~ 85% (Non condensing) |
Note | *Default for 1 x 802.11 a/b/g/n/ac wireless & BT 5.0 (2T2R) |
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Condition
Brand New
Shipping
This item is shipped directly from our supplier in China with tracking.